Summary Information:
Aehr Test Systems Common Stock
NASDAQ:AEHR


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Aehr Test Systems Common Stock
Exchange: NASDAQ
Symbol: AEHR
SEC CIK: 0001040470
Phone: 5106239400
400 KATO TERRACE
FREMONT CA 94539

CEO: Gayn Erickson
Price when page updated: 23.19 Date: 2023-11-30
Company Website:
www.aehr.com

_Description: Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePakĀ® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules.

IPO YEAR:
1997
Sector:
Capital Goods
Industry:
Electrical Products
ADRTSO:

MarketCap:
667856068.00
Beta:
1.566782988534318
52 Week High:
27.09
52 Week Low:
1.94
52 Week Change:
7.287449392712549
Short Interest:

Short Date:

Shares Outstanding:
26557065
Dividend Rate:
0
Dividend Yield:
0.62%
ExDividend Date:

Latest EPS:

Latest EPS Date:
N/A
Float:
0
return on Equity:
4.50%
Consensus EPS:

Number Of Estimates:

EPS Surprise Dollar:

Eps Surprise Percent:

EBITDA:
AUD$18.637M
ttmEPS:
0
Revenue:
AUD$68.327M
Gross Profit:

Cash:

Debt:

Institution Percent:
40.60%
Revenue Percent:

Revenue Per Employee:

Insider Percent:
4.00%
Return on Assets:
3.10%
Return on Capital:

Profit Margin:
2.40%
Price to Sales:
9.52
Price To Book:
10.99
Short Ratio:
2.27
PE Ratio:
0
Employees:
71
1Y Guesstimate
23.586:1.0:3




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